Complete Guide to BGA CPU & eMMC Reballing Temperatures

Reballing smartphone processor chips requires precise temperature calibration to avoid blistering PCB layers.

• Pre-heating: 180°C - 200°C for 30 seconds around the IC shield.
• IC Extraction: 330°C - 350°C with 60% airflow using bent tweezers.
• Stencil Soldering: Low-melt 138°C or standard 183°C mechanic solder paste heated uniformly under the microscope.